HEI  (Hybrid Electronics)

Patents in grey text have expired

HIMPP HEI-01: Title: High density stacked circuit module
US 6,014,320

HIMPP HEI-02: Title: High-frequency interconnection for circuits
US 6,294,966
US 6,838,953

HIMPP HEI-03: Title: Connection for conducting high frequency signal between a circuit and a discrete electric component
US 6,646,521

HIMPP HEI-04: Title: Hearing aid assembly using folded flex circuits
US 6,674,869